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US 9,851,520 B2Granted
Optical communication component cooling
OwnerVadim Gektin, Xing Fu +1inventors
InventorsVadim Gektin, Xing Fu, Chengpeng Yang
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Abstract
An optical communication package includes a circuit layer, an optical component electrically coupled to the circuit layer to optically communicate outside of the package, and a thermoelectric cooler electrically coupled to the circuit layer and disposed to transfer heat from the optical component to the circuit layer.
Claims20
An optical communication package comprising:
- a circuit layer;
- a optical component disposed parallel to and below the circuit layer and electrically coupled to the circuit layer to optically communicate outside of the package;
- and
- a thermoelectric cooler that:
- is embedded in an interposer layer between the circuitry layer and the optical components, and is thermally coupled to and disposed directly between the circuit layer and the optical component;
- and
- comprises doped semiconductor columns that conduct heat that are axially disposed in an orthogonal manner to the optical component and circuit layer.
4 more elements
An optical communication package comprising:
- a substrate having an opening;
- at least two redistribution layers supported by and electrically coupled to the substrate;
- a circuit layer supported by and electrically coupled to the redistribution layer;
- an optical components disposed parallel to the circuit layer and electrically coupled to the redistribution layer and the circuit layer via the at least two redistribution layers and positioned to optically communicate through the opening in the substrate;
- and
- a thermoelectric cooler that:
- is thermally coupled to and is disposed directly between the at least two redistribution layers between the circuit layer and the optical component;
- and
- comprises doped semiconductor columns that conduct heat that are axially disposed in an orthogonal manner to the optical component and circuit layer.
6 more elements
A system comprising:
- an optical communications chip having a circuit layer;
- an interposer layer having at least two redistribution layers;
- an optical component disposed parallel to the circuit layer and electrically coupled to the circuit layer via the at least two redistribution layers;
- a thermoelectric cooler that:
- is thermally coupled to and disposed directly between the two redistribution layers disposed between the circuit layer and the optical component;
- and
- comprises doped semiconductor columns that conduct heat that are axially disposed in an orthogonal manner to the optical component and circuit layer;
- and
- a printed circuit board (PCB) supporting a second optical component optically coupled to the optical component.
6 more elements
Dependencies are inferred from the claim text.