Via leakage and breakdown testing
AssigneeGlobalfoundries Inc.
InventorsFen Chen, Roger A. Dufresne, Charles W. Griffin, Kevin W. Kolvenbach
Life of this patent
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Abstract
Various particular embodiments include a via testing structure, including: a first terminal coupled to a first set of sensing lines in a top level of the structure; a second terminal coupled to a second set of sensing lines in the top level of the structure, wherein first set of sensing lines and the second set of sensing lines are disposed in a comb arrangement; a third terminal coupled to a third set of sensing lines in a bottom level of the structure; and a plurality of vias electrically coupling the second set of sensing lines in the top level of the structure to the third set of sensing lines in the bottom level of the structure, each via having a via top and a via bottom.
Claims18
A testing structure, comprising:
- a first three terminal via testing structure, including:
- a first terminal coupled to a first set of sensing lines in a top level of the structure;
- a second terminal coupled to a second set of sensing lines in the top level of the structure, wherein first set of sensing lines and the second set of sensing lines are disposed in a comb arrangement;
- a third terminal coupled to a third set of sensing lines in a bottom level of the structure;
- and
- a plurality of vias electrically coupling the second set of sensing lines in the top level of the structure to the third set of sensing lines in the bottom level of the structure, each via having a via top and a via bottom.
A semiconductor wafer, comprising:
- a first three terminal via testing structure, including:
- a first terminal coupled to a first set of sensing lines in a top level of the structure;
- a second terminal coupled to a second set of sensing lines in the top level of the structure, wherein first set of sensing lines and the second set of sensing lines are disposed in a comb arrangement;
- a third terminal coupled to a third set of sensing lines in a bottom level of the structure;
- and
- a plurality of vias electrically coupling the second set of sensing lines in the top level of the structure to the third set of sensing lines in the bottom level of the structure, each via having a via top and a via bottom.
A testing method, comprising:
- providing a three terminal via testing structure including at least one via, the three terminal via testing structure including:
- a first terminal coupled to a first set of sensing lines in a top level of the structure;
- a second terminal coupled to a second set of sensing lines in the top level of the structure, wherein first set of sensing lines and the second set of sensing lines are disposed in a comb arrangement;
- a third terminal coupled to a third set of sensing lines in a bottom level of the structure;
- and
- the at least one via electrically coupling at least one sensing line in the second set of sensing lines in the top level of the structure to at least one line in the third set of sensing lines in the bottom level of the structure, each via having a via top and a via bottom;
- and
- isolating and obtaining via top measurement data at a top of the via and via bottom data at the bottom of the via using the three terminal via testing structure.
Dependencies are inferred from the claim text.