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US 9,851,379 B2Granted
Test probe substrate
AssigneeInternational Business Machines Corporation
InventorsBing Dang, John U. Knickerbocker, Jae-Woong Nah, Robert E. Trzcinski, Cornelia Kang-I Tsang
Life of this patent
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Abstract
A test probe structure having a planar surface and contact locations matched to test hardware is provided. The fabrication of the test probe structure addresses problems related to the possible deformation of base substrates during manufacture. Positional accuracy of contact locations and planarity of base substrates is achieved using dielectric layers, laser ablation, injection molded solder or redistribution layer wiring, and planarization techniques.
Claims17
A method comprising:
- obtaining a structure comprising a test probe substrate including a top surface, a plurality of first and second contact locations arranged in rows and columns, one or more of the second contact locations being misaligned with respect to the first contact locations, and electrical conductors within the substrate, the first and second contact locations being electrically connected to one or more of the electrical conductors;
- forming a first dielectric layer over the top surface of the substrate;
- forming a plurality of first openings within the first dielectric layer, each of the first openings corresponding to one of the first and second contact locations;
- forming one or more lateral extensions of the first openings that correspond to the one or more misaligned second contact locations within the first dielectric layer, each of the one or more lateral extensions extending radially with respect to one of the first openings;
- depositing an electrically conductive material within the first openings and lateral extensions such that the electrically conductive material contacts the first and second contact locations;
- depositing a second dielectric layer over the first dielectric layer;
- forming a plurality of second openings within the second dielectric layer, the plurality of second openings being arranged in parallel rows without misalignment, one or more of the second openings being aligned with and communicating with the one or more lateral extensions, others of the second openings being aligned with the first openings that correspond to the first contact locations;
- depositing an additional electrically conductive material within the second openings to form an array of electrical contact regions electrically connected to the first and second contact locations, and
- planarizing the second dielectric layer.
6 more elements
Dependencies are inferred from the claim text.