Physical quantity sensor
AssigneeHitachi Automotive Systems, Ltd.
InventorNoriyuki Sakuma
Life of this patent
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Abstract
A thermal type sensor molded from a mold resin having an opening has a problem in that the residual stress of the mold resin in the opening causes peeling at the interface having poor adhesion. A physical quantity sensor has a construction having a semiconductor chip having a detector unit 3, a frame 8a on which the semiconductor chip is mounted, a mold resin portion 10 which encapsulates the semiconductor chip and the frame and has an opening through which the detector unit is exposed to the outside, and a stress absorbing layer 6 which is formed between an end of the opening in the mold resin portion and a wiring layer formed in the detector unit, and which is formed from a metal material that absorbs a stress from the end.
Claims12
A physical quantity sensor, characterized by having:
- a semiconductor chip having a detector unit,
- a frame on which the semiconductor chip is mounted,
- a mold resin portion which encapsulates the semiconductor chip and the frame and has an opening through which the detector unit is exposed to outside of the physical quantity sensor, and
- a stress absorbing layer being formed between ends of the opening in the mold resin portion and above a wiring layer formed in the detector unit, and the stress absorbing layer contains a metal material which absorbs a stress from the ends of the opening,
- wherein a first portion of the stress absorbing layer protrudes beyond a first edge of the opening to be exposed from the mold resin portion and inside of an edge of the semiconductor chip, and a second portion of the stress absorbing layer protrudes beyond a second edge of the opening to be exposed from the mold resin portion and above only a central portion of the wiring layer, and
- wherein the detector unit has a diaphragm, and a width of an upper end of the diaphragm is smaller than a distance between the first and second portions of the stress absorbing layer.
Dependencies are inferred from the claim text.