Heat exchanger construction using low temperature sinter techniques
AssigneeLockheed Martin Corporation
InventorsDavid L. Vos, Stephen Schober
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AssigneeLockheed Martin Corporation
InventorsDavid L. Vos, Stephen Schober
Estimating the term…
Some embodiments relate to constructing a heat exchanger using nanoink as a thermal bond interface between portions of the heat exchanger. The heat exchanger may comprise fins and at least one base. A nanoink may be applied to at least a portion of the fins. The pieces of the heat exchanger may be sintered such that the nanoink melts and forms a bond between the pieces of the heat exchanger. Some embodiments include a second base. Some embodiments incorporate dissimilar materials within the heat exchanger construction.
A method for use in relation to a heat exchanger used in conducting heat from a heat source, the heat exchanger comprising a base comprised of a base material and fins comprised of a fin material, the method comprising acts of:
Dependencies are inferred from the claim text.
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Of metal: coatings, claddings or bonding layers made from metals or metal alloys
The means being only outside the tubular element: consisting of zig-zag shaped fins
Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations: the means being…
Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes: sintered
About 7 years 4 months of term left · ends 14 Feb 2034 (estimated)
1. Technical Field
The techniques described herein relate to a process for constructing heat exchangers using low temperature sinter techniques and the heat exchangers that result from the process.
2. Discussion of Related Art
The accompanying drawings are not intended to be drawn to scale. In the drawings, each identical or nearly identical component that is illustrated in various figures is represented by a like numeral. For purposes of clarity, not every component may be labeled in every drawing. In the drawings:
FIG. 1 is a simplified cross-section view of a heat exchanger, according to some embodiments;
FIG. 2 is a simplified cross-section view of a heat exchanger, according to some embodiments;
Some embodiments are directed to the process of constructing a heat exchanger. The inventors have recognized and appreciated that by using nanoinks, the cost and time of constructing a heat exchanger may be significantly reduced while increasing the performance of the heat exchanger itself.
Heat exchangers may be used in military applications, such as in electronic actuators and/or other electronics used on aircraft or other vehicles. These components may be exposed to harsh environments such as salt-water, a wide range of water entrainment and a wide range of temperatures. Thus, heat exchangers should be constructed from materials that can withstand these demanding environments.
Using nanoink as an interface between components of a heat exchanger provides a wide range of construction options that are not available using brazing techniques while providing superior performance as compared to heat exchanger made using organic bonding. Nanoinks are a solution or paste of nanoparticles mixed with some “carrier solution” that controls the viscosity of the nanoink. The carrier solution is not limited in any way, but may be optimized based on the method used to apply the nanoink. For example, the carrier solution may be water, an alcohol, a hydrocarbon fluid or some other organic fluid. The nanoparticles in the nanoink may be, for example, metallic or thermally conductive nanoparticles. The prefix “nano” refers to the fact that the nanoparticles have a diameter that is best described in terms of nanometers (or 10−9 meters). The nanoparticles may have a diameter ranging from 1 nanometer to about 2500 nanometers.