US 9,850,578 B1 · Shielding coating for selective metallization

Abstract

Shielding coatings are applied to polymer substrates for selective metallization of the substrates. The shielding coatings include a primer component and a hydrophobic top coat. The primer is first applied to the polymer substrate followed by application of the top coat component. The shielding coating is then selectively etched to form an outline of a desired current pattern. A catalyst is applied to the patterned polymer substrate followed by electroless metal plating in the etched portions. The portions of the polymer substrate which contain the shielding coating inhibit electroless metal plating. The primers contain five-membered heterocyclic nitrogen compounds and the top coat contains hydrophobic alky organic compounds.

Claims14

Dependent claims

A method of metallization of a polymer substrate comprising:

a) providing a polymer substrate;
b) applying a primer comprising a 6-membered heterocyclic nitrogen compound to the polymer substrate to provide a hydrophilic coating on the polymer substrate;
c) applying a hydrophobic top coat directly adjacent the primer to form a shielding coating on the substrate, the hydrophobic top coat comprises one or more compounds chosen from alkyl alcohol alkoxylates, alkyl thiols, primary alkyl amines and secondary alkylamines;
d) selectively etching the shielding coating to expose portions of the polymer substrate;
e) providing a catalyst to the polymer substrate;
and
f) selectively electroless metal plating the polymer substrate.

4 more elements

Dependencies are inferred from the claim text.

Shielding coating for selective metallization

Life of this patent

Shielding coating for selective metallization

Life of this patent

Abstract

Claims14