High temperature debondable adhesive
AssigneesHenkel AG & Co. KGaA, Henkel IP & Holding GmbH
InventorsWenhua Zhang, Xiaoyan Huang, Shengqian Kong, Xiao Allison Yue, Stephen Hynes, Jiangbo Ouyang, Chunyu Sun
Life of this patent
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Abstract
A debondable adhesive composition comprising (A) the hydrosilation reaction product of the reaction between the vinyl groups on 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane and the terminal Si—H hydrogens on a silane or siloxane having terminal Si—H hydrogens, (B) a cross-linker for the hydrosilation reaction product, and (C) a metal catalyst and/or a radical initiator is provided.
Claims15
A curable, debondable adhesive composition comprising
- (A) an adduct of 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane and Si—H-terminated silane or siloxane,
- (B) a crosslinker for the adduct of (A), wherein the crosslinker is selected from the group consisting of poly(methylhydro)siloxane, methylhydrosiloxane-dimethylsiloxane copolymer, dimethylsilylphenyl ether, polymethylphenylsiloxane, and poly(methylhydro) phenyl siloxane and
- (C) a metal catalyst and/or radical initiator.
An assembly of a substrate and a carrier, and a debondable adhesive composition disposed between, in which the debondable adhesive comprises
- (A) an adduct of 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane and Si—H-terminated silane or siloxane,
- (B) a cross-linker for the hydrosilation reaction product, and
- (C) a metal catalyst or radical initiator.
Dependencies are inferred from the claim text.