Back to results
US 9,850,406 B2Granted
Adhesive resins for wafer bonding
AssigneeInternational Business Machines Corporation
InventorsRobert D. Allen, Jeffrey Gelorme, Li-Wen Hung, Ratnam Sooriyakumaran, Linda K. Sundberg
Life of this patent
Estimating the term…
Abstract
An adhesive bonding method that includes bonding a handling wafer to a front side surface of a device wafer with an adhesive comprising N-substituted maleimide copolymers. The device wafer may then be thinned from the backside surface of the device wafer while the device wafer is adhesively engaged to the handling wafer. The adhesive can then be removed by laser debonding, wherein the device wafer is separated from the handling wafer.
Claims5
An adhesive bonding method comprising:
- bonding a handling wafer to a front side surface of a device wafer with an adhesive comprising N-substituted maleimide copolymers, wherein the N-substituted maleimide copolymer comprises poly(dodecyl vinyl ether-co-phenylmaleimide);
- thinning the device wafer from the backside surface of the device wafer while the device wafer is adhesively engaged to the handling wafer;
- and
- removing the adhesive by laser debonding, wherein the device wafer is separated from the handling wafer.
1 more element
Dependencies are inferred from the claim text.