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US 9,850,401 B2Granted
Multilayered polyimide film having a low dielectric constant, laminate structure including the same and manufacture thereof
AssigneeTaimide Technology Incorporation
InventorsChung-Ting Lai, Chih-Wei Lin
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Abstract
A multilayered polyimide film includes a first polyimide layer containing fluorine-containing polymer particles and having a first surface and a second surface, and a second polyimide layer and a third polyimide layer respectively disposed on the first surface and the second surface. The second and the third polyimide layers contain organic silicon oxygen compound particles. The multilayered polyimide film has a coefficient of thermal expansion (CTE) between about 13 and about 30 ppm/° C.
Claims13
A multilayered polyimide film comprising:
- a first polyimide layer incorporating fluorine-containing polymer particles, and having a first surface and a second surface;
- and
- a second polyimide layer and a third polyimide layer respectively disposed on the first surface and the second surface, the second and the third polyimide layers respectively containing organic silicon oxygen compound particles;
- wherein the multilayered polyimide film has a coefficient of thermal expansion (CTE) between about 13 and about 30 ppm/° C.
1 more element
Dependencies are inferred from the claim text.