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US 9,850,375 B2Granted
Resin composition, copper clad laminate and printed circuit board using same
AssigneeElite Electronic Material (Kunshan) Co., Ltd.
InventorsRongtao Wang, Yu-Te Lin, Wenjun Tian, Ziqian Ma, Wenfeng Lv, Ningning Jia
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Abstract
The present invention provides a resin composition comprising: (A) 100 parts by weight of epoxy resin; (B) from 10 to 80 parts by weight of benzoxazine resin; (C) from 10 to 50 parts by weight of dicyclopentadiene phenol resin; and (D) from 0.5 to 5 parts by weight of amine hardener; wherein the resin composition is free of diallyl bisphenol A (DABPA).
Claims15
A resin composition comprising:
- (A) 100 parts by weight of epoxy resin;
- (B) from 10 to 80 parts by weight of benzoxazine resin;
- (C) from 10 to 50 parts by weight of dicyclopentadiene phenol resin;
- and
- (D) from 0.5 to 5 parts by weight of amine hardener;
- wherein the resin composition is free of diallyl bisphenol A (DABPA), and wherein said resin composition is capable of preparing a copper clad laminate having a glass transition temperature (Tg) measured by differential scanning calorimetry (DSC) greater than 140° C., a dielectric constant (Dk) less than about 4.3, and a dissipation factor (Df) less than about 0.013 and configured to withstand greater than 20 minutes of a heat resistance T288 capacity test by which the laminate is tested for delamination at 288° C.
3 more elements
Dependencies are inferred from the claim text.