High speed laser processing of transparent materials
AssigneeCorning Incorporated
InventorsManoj K. Bhuyan, Ottavia Jedrkiewicz, Paolo Di Trapani, Vytautas Sabonis, Mindaugas Mikutis
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AssigneeCorning Incorporated
InventorsManoj K. Bhuyan, Ottavia Jedrkiewicz, Paolo Di Trapani, Vytautas Sabonis, Mindaugas Mikutis
Estimating the term…
A method and system for laser pre-cutting a layered material (31) with a laser beam (14) is disclosed. The layered material (31) comprises at least one tensile stress layer (TSL), at least one compression stress layer (CSL1, CSL2), and at least one interface region (IR1, IR2) between the at least one tensile stress layer (TSL) and the at least one compression stress layer (CSL1, CSL2) and is transparent to allow propagation of the laser beam (14) through the layered material (31). The method may comprise setting an optical beam path (8) and a laser characteristic of the laser beam (14) such that an interaction of the laser beam (14) with the layered material (31) generates an elongate damage region (57) in the layered material (31), and, for each of a series of pre-cut positions (XN−1, XN, XN+1) of the layered material (31), pre-cutting the layered material (31) by positioning the layered material (31) and the laser beam (14) with respect to each other and irradiating the laser beam (14) such that the respective elongate damage regions (57) extend across the at least one interface region (IR1, IR2).
A method for laser pre-cutting a layered material with a pulsed Bessel-like laser beam or a filament forming Gaussian beam, wherein the layered material comprises at least one tensile stress layer, at least one compression stress layer, and at least one interface region between the at least one tensile stress layer and the at least one compression stress layer and the layered material is transparent to allow propagation of the laser beam through the layered material, the method comprising:
Dependencies are inferred from the claim text.