Integrated circuit package and method of forming same

A method comprising:

• attaching a first side of a first die to a carrier, the first die having:
• a first contact pad on a second side of the first die, the second side of the first die being opposite the first side of the first die;
• and
• a first insulating layer on the second side of the first die, at least a portion of the first contact pad being exposed through an opening in the first insulating layer;
• attaching a first side of a second die to the carrier, the second die having:
• a through via, the through via extending from the first side of the second die to a second side of the second die, the second side of the second die being opposite the first side of the second die;
• a second insulating layer on the second side of the second die, at least a portion of the through via extending through the second insulating layer;
• and
• a second contact pad over the second insulating layer, the second contact pad contacting the through via;
• laminating a release layer over top surfaces of the first contact pad, the second contact pad, the first insulating layer and the second insulating layer;
• injecting a first encapsulant between the carrier and the release layer, and in a gap between the first die and the second die;
• and
• forming one or more redistribution layers (RDLs) over the first die, the second die and the first encapsulant, the first contact pad and the second contact pad being in electrical contact with the one or more RDLs.

A method comprising:

• forming a release layer over a first die, a second die, a third die, and a fourth die, the first, second, third, and fourth dies over and connected to a carrier;
• injecting an encapsulant in gaps between the first die, the second die, the third die, and the fourth die, wherein a topmost surface of the encapsulant is below a topmost surface of the first die, a topmost surface of the second die, a topmost surface of the third die, and a topmost surface of the fourth die;
• forming one or more redistribution layers (RDLs) over the first die, the second die, the third die, the fourth die, and the encapsulant;
• forming connectors over the one or more RDLs;
• de-bonding the carrier to leave a resulting structure comprising the first die, the second die, the third die, the fourth die, the encapsulant, the one or more RDLs, and the connectors over the one or more RDLs;
• and
• dicing the resulting structure to form a first integrated circuit package and a second integrated circuit package, the first integrated circuit package comprising the first die, the second die, a first subset of the encapsulant, a first subset of the one or more RDLs, and a first subset of the connectors over the first subset of the one or more RDLs, the second integrated circuit package comprising the third die, the fourth die, a second subset of the encapsulant, a second subset of the one or more RDLs, and a second subset of the connectors over the second subset of the one or more RDLs.