Stress relief MEMS structure and package
AssigneeMKS Instruments, Inc.
InventorsLei Gu, Stephen F. Bart
Life of this patent
Estimating the term…
Abstract
Stress relief structures and methods that can be applied to MEMS sensors requiring a hermetic seal and that can be simply manufactured are disclosed. The system includes a sensor having a first surface and a second surface, the second surface being disposed away from the first surface, the second surface also being disposed away from a package surface and located between the first surface and the package surface, a number of support members, each support member extending from the second surface to the package surface, the support members being disposed on and operatively connected to only a portion of the second surface. The support member are configured to reduce stress produced by package-sensor interaction.
Claims11
A method for fabricating a sensor system, comprising:
- etching into a surface of a component of a sensor structure, the sensor structure having a first surface, in order to form a second surface of the sensor structure and one or more support members disposed on the second surface;
- the second surface being disposed away from the first surface;
- the second surface also being disposed away from a package surface and located between the first surface and the package surface;
- the one or more support members being configured to reduce stress produced by package-sensor interaction;
- wherein
- a first support member from the one or more support members surrounds a central region of the second surface;
- and a second support member surrounds the first support member.
Dependencies are inferred from the claim text.