Packaging structure for packing substrate storing container

A packing structure for packing a substrate storing container for storing and transporting substrates composed of semiconductor wafers, comprising:

• a packing box;
• and
• a lower cushioning material on which the substrate storing container is placed in the packing box,
• wherein the lower cushioning material includes a first cushioning portion and a second cushioning portion,
• wherein the first cushioning portion includes:
• a cushioning support portion that is configured by a cushioning material, and directly abuts the substrate storing container to support the substrate storing container;
• and a cushioning-portion connecting portion that is configured by a cushioning material, is connected to the cushioning support portion, and extends downwards from the cushioning support portion,
• wherein the second cushioning portion includes:
• a cushioning plate-like portion in which a through-hole is formed;
• and cushioning leg portions which are configured by a cushioning material which is softer than the cushioning-portion connecting portion of the first cushioning portion, and extend downwards from the cushioning plate-like portion, and
• wherein the cushioning plate-like portion supports the first cushioning portion in a state in which the cushioning-portion connecting portion penetrates through the through-hole of the cushioning plate-like portion.