Manufacturing method for a fluid-ejection device, and fluid-ejection device

A method, comprising:

• producing a nozzle plate, including:
• forming a first nozzle cavity, having a first diameter, in a first semiconductor body;
• forming a first etch-stop layer on the first semiconductor body and on inner walls of said first nozzle cavity;
• forming a structural layer on the first etch-stop layer;
• and
• etching the structural layer, the etching forming a second nozzle cavity and setting the first and second nozzle cavities in mutual fluidic communication, the second nozzle cavity extending to the first etch-stop layer, being aligned to the first nozzle cavity in a fluid-ejection direction, and having a second diameter larger than the first diameter.

A method, comprising:

• manufacturing a device for ejecting a fluid, the manufacturing including:
• producing a nozzle plate in a first semiconductor body;
• producing a containment chamber, adapted to contain said fluid, in a second semiconductor body;
• and
• affixing the first semiconductor body to the second semiconductor body after producing the nozzle plate in a first semiconductor body and after producing the containment chamber in the second semiconductor body, producing the nozzle plate including:
• forming a first nozzle cavity in the first semiconductor body prior to coupling the first semiconductor body to the second semiconductor body;
• forming a structural layer on the first semiconductor body and in the first nozzle cavity prior to coupling the first semiconductor body to the second semiconductor body;
• and
• forming in the structural layer a second nozzle cavity prior to coupling the first semiconductor body to the second semiconductor body, the second nozzle cavity being aligned to the first nozzle cavity in a fluid-ejection direction and having a second diameter larger than the first diameter, the first and second nozzle cavities being fluidly connected to each other.