Mold release film and production method for same
AssigneeUnitika Ltd.
InventorsGoro Araki, Nobuyasu Okumura, Yoshimi Ueno
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Abstract
The present invention provides a mold release film including a resin layer provided on one surface of a polyester film, wherein the resin layer includes 100 parts by mass of a polypropylene-based modified polyolefin resin with the proportion of a modifying component of 1 to 10% by mass and 1 to 50 parts by mass of a cross-linking agent; the peel strength between the resin layer and a pressure-sensitive adhesive measured by bonding a rubber-based pressure-sensitive adhesive to the resin layer exceeds 3.0 N/cm; and the residual adhesion rate of a pressure-sensitive adhesive after bonding an acrylic pressure-sensitive adhesive to the resin layer is 80% or more.
Claims5
A mold release film comprising a resin layer provided on one surface of a polyester film,
- wherein the resin layer includes 100 parts by mass of a polypropylene-based modified polyolefin resin with a proportion of a modifying component of 1 to 10% by mass and 1 to 50 parts by mass of a cross-linking agent;
- a peel strength between the resin layer and a pressure-sensitive adhesive measured by bonding a rubber-based pressure-sensitive adhesive to the resin layer exceeds 3.0 N/cm;
- and
- a residual adhesion rate of the pressure-sensitive adhesive after bonding an acrylic pressure-sensitive adhesive to the resin layer is 80% or more;
- and
- a contact angle of water on an opposite surface to the surface provided with the resin layer is 75° or less.
Dependencies are inferred from the claim text.