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US 9,849,648 B2Granted
Cleaning apparatus for mobile device
OwnerChan Kwon Leeinventor
Life of this patent
Estimating the term…
Abstract
A cleaning apparatus for a mobile device. The cleaning apparatus comprises: a support plate; a sealing layer attached under the support plate; and a wiping layer disposed under the sealing layer, wherein a cleaning solution receiving part for receiving cleaning solution is formed between the support plate and the sealing layer, the sealing layer has a through hole extending to the wiping layer, and the cleaning solution is discharged to the wiping layer through the through hole.
Claims16
A cleaning apparatus for a mobile device, comprising:
- a supporting plate;
- a sealing layer joined below the supporting plate;
- and
- a wiping layer disposed below the sealing layer,
- wherein a cleaning solution accommodating portion which contains a cleaning solution is formed between the supporting plate and the sealing layer,
- wherein the sealing layer comprises a through hole which extends to the wiping layer, and
- wherein the cleaning solution is ejected to the wiping layer through the through hole,
- wherein the cleaning solution accommodating portion comprises two or more cleaning solution accommodating grooves independently divided from one another, and
- wherein the respective cleaning solution accommodating grooves independently eject the cleaning solution to the wiping layer.
6 more elements
A cleaning apparatus for a mobile device, comprising:
- a first sealing layer;
- a second sealing layer disposed below the first sealing layer;
- and
- a wiping layer attached to the second sealing layer,
- wherein a cleaning solution accommodating portion is formed between the first sealing layer and the second sealing layer,
- wherein the second sealing layer comprises a through hole through which a cleaning solution contained in the cleaning solution accommodating portion is ejected to the wiping layer,
- wherein a second joint portion and a third joint portion are formed by mutually joining the first sealing layer and the second sealing layer,
- wherein an ejection pressure applying portion which extends from the cleaning solution accommodating portion to the through hole is formed between the second joint portion and the third joint portion,
- wherein a width of the ejection pressure applying portion is from 0.5 cm to 3 cm,
- wherein a length of the ejection pressure applying portion is from 0.5 cm to 5 cm,
- wherein the first sealing layer and the second sealing layer are in contact with or stuck to each other to form a temporary shutoff portion at the ejection pressure applying portion, and
- wherein the temporary shutoff portion temporarily shuts off a movement of the cleaning solution from the cleaning solution accommodating portion to the through hole.
9 more elements
A cleaning apparatus for a mobile device, comprising:
- a first sealing layer;
- a second sealing layer disposed below the first sealing layer;
- and
- a wiping layer disposed below the second sealing layer,
- wherein a joint portion is formed by directly or indirectly joining the first sealing layer to the second sealing layer,
- wherein a cleaning solution accommodating portion which contains a cleaning solution is formed in an area surrounded by the joint portion between the first sealing layer and the second sealing layer,
- wherein the second sealing layer comprises a through hole for ejecting the cleaning solution to the wiping layer,
- wherein an average height of the cleaning solution accommodating portion is from 0.05 mm to 2 mm, and
- wherein a viscosity of the cleaning solution is from 10 cps to 1000 cps,
- wherein the joint portion comprises a first joint portion which surrounds the cleaning solution accommodating portion, a second joint portion which extends from the first joint portion, and a third joint portion which is spaced from the second joint portion and extends from the first joint portion,
- wherein an ejection pressure applying portion which extends from the cleaning solution accommodating portion to the through hole is formed between the second joint portion and the third joint portion,
- wherein a width of the ejection pressure applying portion is from 0.5 cm to 3 cm, and
- wherein a length of the ejection pressure applying portion is from 0.5 cm to 5 cm.
10 more elements
Dependencies are inferred from the claim text.