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US 9,849,558 B2Granted
Polishing pad dresser, polishing apparatus and polishing pad dressing method
AssigneeToshiba Memory Corporation
InventorsTakayuki Nakayama, Dai Fukushima
Life of this patent
Estimating the term…
Abstract
In one embodiment, a polishing pad dresser includes a first base portion, and first convex portions provided in a first region of the first base portion. Furthermore, a width of the first convex portions is 1 to 10 μm, a height of the first convex portions is 0.5 to 10 μm, and a density of the first convex portions in the first region is 0.1 to 50%.
Claims20
A polishing pad dresser comprising:
- a first base portion;
- first convex portions provided in a first region of the first base portion;
- a second base portion adjacent to the first base portion;
- and
- second convex portions provided in a second region of the second base portion,
- wherein
- a width of the first convex portions is 1 to 10 μm,
- a height of the first convex portions is 0.5 to 10 μm,
- a density of the first convex portions in the first region is 0.1 to 50%,
- a width of the second convex portions is greater than 10 μm, and
- a height of the second convex portions is greater than 10 μm.
8 more elements
A polishing apparatus comprising:
- a polishing pad configured to polish a substrate;
- a polishing head configured to hold the substrate to bring the substrate into contact with the polishing pad;
- and
- a polishing pad dresser including a first base portion, first convex portions provided in a first region of the first base portion, a second base portion adjacent to the first base portion, and second convex portions provided in a second region of the second base portion, and configured to dress the polishing pad with the first and second convex portions,
- wherein
- a width of the first convex portions is 1 to 10 μm,
- a height of the first convex portions is 0.5 to 10 μm,
- a density of the first convex portions in the first region is 0.1 to 50%,
- a width of the second convex portions is greater than 10 μm, and
- a height of the second convex portions is greater than 10 μm.
7 more elements
A polishing Dad dressing method comprising:
- preparing a polishing pad dresser including a first base portion, first convex portions provided in a first region of the first base portion, a second base portion adjacent to the first base portion, and second convex portions provided in a second region of the second base portion, a width of the first convex portions being 1 to 10 μm, a height of the first convex portions being 0.5 to 10 μm, a density of the first convex portions in the first region being 0.1 to 50%, a width of the second convex portions being greater than 10 μm, and a height of the second convex portions being greater than 10 μm, and
- dressing the polishing pad with the first and second convex portions of the polishing pad dresser.
Dependencies are inferred from the claim text.