Cleaning composition after chemical mechanical polishing of organic film and cleaning method using the same
AssigneeSamsung Electronics Co., Ltd.
InventorsAhn-Ho Lee, Chung-Kyung Jung, Dong-Min Kang, Dong-Hun Kang, Go-Un Kim, Dong-Jin Kim, Yong-Sik Yoo, Young-Chul Jung, Yu-Ri Jung, Jung-Min Choi, Sang-Kyun Kim
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Abstract
A cleaning composition includes an organic solvent, an organic acid, a chelating agent, a surfactant containing at least one hydroxyl group (OH) at the end, and an ultra pure water, wherein a pH value of the cleaning composition is equal to or higher than 12.
Claims14
A composition for cleaning an organic film, the composition comprising:
- an organic solvent, an organic acid, a chelating agent, a surfactant containing at least one hydroxyl group (OH) at an end, and an ultra pure water,
- wherein a pH value of the composition is greater than or equal to 12,
- wherein the composition includes 0.01 to 10.00 wt % of the organic solvent, 0.01 to 3.00 wt % of the organic acid, 0.01 to 1.00 wt % of the chelating agent, 0.0001 to 0.2 wt % of the surfactant, and 85.8 to 99.9 wt % of the ultra pure water based on a total weight of the composition.
A cleaning composition comprising an aromatic surfactant containing at least one hydroxyl group (OH) at an end, the surfactant including 20 or less aromatic rings, wherein a pH value of the cleaning composition is greater than or equal to 12, and
- wherein the cleaning composition includes 0.01 to 10.00 wt % of an organic solvent, 0.01 to 3.00 wt % of an organic acid, 0.01 to 1.00 wt % of a chelating agent 0.001 to 0.2 wt % of the surfactant, and 85.8 to 99.9 wt % of an ultra pure water based on a total weight of the cleaning composition.
Dependencies are inferred from the claim text.