Curable adhesive compositions for flexible substrates
AssigneeSaes Getters S.P.A.
InventorsPaolo Vacca, Marco Mudu, Jiabril Gigli
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Abstract
A thermally or photo curable adhesive composition containing a bisphenol F epoxy resin and a bisphenol A epoxy resin in a ratio between 2 and 10. The composition further contains at least one epoxy acrylate component and a rubber modified bisphenol. The adhesive composition is applicable by a melt or liquid coating technique and undergoes curing upon exposure to heat or radiation, showing improved viscoelastic properties and suitable to provide a cured product having superior durability.
Claims15
A curable adhesive composition containing a bisphenol F epoxy resin, a bisphenol A epoxy resin and at least one epoxy acrylate component, wherein the weight ratio of bisphenol F with respect to bisphenol A is comprised between 4 and 8 and wherein said composition further contains a rubber modified epoxy resin.
Dependencies are inferred from the claim text.