Liquid ejecting head and liquid ejecting apparatus
AssigneeSeiko Epson Corporation
InventorIsamu Togashi
Life of this patent
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Abstract
Provided is a liquid ejecting head which includes head bodies aligned in a direction of liquid ejection surface thereof, a flow-path member in which distribution flow path is provided to supply liquid to the head bodies, and flexible wiring substrates connected to the head bodies. The distribution flow path extends in the first direction. In addition, the flexible wiring substrates adjacent in the first direction overlap when viewed from the first direction. The distribution flow path is disposed in an area on one side with respect to the flexible wiring substrates, in a direction perpendicular to the first direction in the liquid ejection surface.
Claims21
A liquid ejecting head comprising:
- head main bodies having liquid ejection surfaces;
- flexible wiring substrates connected to the head main bodies, wherein each flexible wiring substrate is a flexible circuit board or a chip on flexible film;
- a relay substrate connected to the flexible wiring substrates;
- and
- a flow-path member having a distribution flow path branching off into the head main bodies, the flow-path member stacked between the head main bodies and the relay substrate.
The liquid ejecting head according to claim,6 wherein at least a part of the distribution flow path extends in the first direction which is parallel to a liquid ejection surface.
Dependencies are inferred from the claim text.