Method and apparatus for minimizing via compression in a fluid ejection head
AssigneeFunai Electric Co., Ltd.
InventorSteven R Komplin
Life of this patent
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Abstract
A fluid ejection head assembly having improved assembly characteristics and methods of manufacturing a fluid ejection head assembly. The fluid ejection head includes a fluid supply body having at least one fluid supply port in a recessed area therein and a semiconductor chip attached in the recessed area of the fluid supply body adjacent the fluid supply port using a thermal cure adhesive. A compression prevention body having a coefficient of thermal expansion ranging from about 1.0 to less than about 30 microns/meter per ° C. disposed adjacent to the fluid supply port of the fluid supply body and the semiconductor chip.
Claims14
A fluid ejection head assembly comprising a fluid supply body having at least one fluid supply port in a recessed area therein, a semiconductor chip attached in the recessed area of the fluid supply body adjacent the fluid supply port using a thermal cure adhesive, and a compression prevention body having a coefficient of thermal expansion ranging from about 1.0 to less than about 30 microns/meter per ° C. disposed adjacent to the fluid supply port of the fluid supply body and the semiconductor chip, wherein the compression prevention body has a spherical shape.
A method for reducing compressive forces on a semiconductor chip of a fluid ejection head during a thermal cure process for attaching the semiconductor chip to a fluid supply body comprising:
- providing a fluid supply port in a recessed area of the fluid supply body;
- disposing a compression prevention body adjacent to the fluid supply port of the fluid supply body and the semiconductor chip, wherein the compression prevention body has a coefficient of thermal expansion ranging from about 1.0 to less than about 30 microns/meter per ° C., and wherein the compression prevention body has a spherical shape;
- attaching a semiconductor chip in the recessed area of the fluid supply body adjacent to the fluid supply port using a thermal cure adhesive so that the compression prevention body;
- and
- thermally curing the adhesive to fixedly attach the semiconductor chip in the recessed area of the fluid supply body.
A method for reducing via distortion in a semiconductor chip of a fluid ejection head during a thermal cure process for attaching the semiconductor chip to a fluid supply body comprising:
- providing a fluid supply port in a recessed area of the fluid supply body;
- disposing a spherical body adjacent to the fluid supply port of the fluid supply body and the semiconductor chip, wherein the spherical body has a coefficient of thermal expansion ranging from about 1.0 to less than about 30 microns/meter per ° C.;
- attaching a semiconductor chip in the recessed area of the fluid supply body adjacent the fluid supply port using a thermal cure adhesive;
- and
- thermally curing the adhesive to fixedly attach the semiconductor chip in the recessed area of the fluid supply body.
Dependencies are inferred from the claim text.