Image pickup module and the manufacturing method thereof
AssigneeAltek Semiconductor Corp.
InventorJui-Hsin Chang
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AssigneeAltek Semiconductor Corp.
InventorJui-Hsin Chang
Estimating the term…
An image pickup module includes a cover, a plurality of image pickup units, a self-curing gel, and a photopolymer gel. The cover includes an upper shield, a side shield, and illumination openings and image pickup openings on the upper shield, and the upper shield and the side shield surround an accommodation space where the image pickup units are disposed. The cover at least covers a portion of upper surfaces of the image pickup units. The photopolymer gel is disposed on positions corresponding to the illumination openings that expose the photopolymer gel. The self-curing gel is disposed between the upper surfaces of the image pickup units and the upper shield. The photopolymer gel is configured to fix relative positions between the image pickup units and the cover. A manufacturing method of an image pickup module is also provided.
An image pickup module comprising:
A manufacturing method of an image pickup module, comprising:
Dependencies are inferred from the claim text.