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AssigneeSenju Metal Industry Co., Ltd.
InventorsMasato Shimamura, Tsukasa Ohnishi, Mitsuhiro Kosai, Kazuyori Takagi, Tomoko Nonaka, Masayuki Suzuki, Toru Hayashida, Seiko Ishibashi, Shunsaku Yoshikawa, Yoshie Yamanaka
Estimating the term…
By using a solder alloy consisting essentially of 0.2-1.2 mass % of Ag, 0.6-0.9 mass % of Cu, 1.2-3.0 mass % of Bi, 0.02-1.0 mass % of Sb, 0.01-2.0 mass % of In, and a remainder of Sn, it is possible to obtain portable devices having excellent resistance to drop impact and excellent heat cycle properties without developing thermal fatigue even when used in a high-temperature environment such as inside a vehicle heated by the sun or in a low-temperature environment such as outdoors in snowy weather.
A lead-free solder alloy consisting of 0.2-1.0 mass % of Ag, 0.6-0.9 mass % of Cu, 1.2-2.0 mass % of Bi, 0.02-0.5 mass % of Sb, 0.01-0.3 mass % of In, and a remainder of Sn, wherein the mass % of Bi is at least 4 times greater than the mass % of In.
Dependencies are inferred from the claim text.