Production method for deposition mask and deposition mask
AssigneeV Technology Co., Ltd.
InventorMichinobu Mizumura
Life of this patent
Estimating the term…
Abstract
To provide a production method including: a first step of forming a mask member in which a resin film and a magnetic metal member, which has first through-holes and second through-holes, are brought into close contact; a second step in which a peripheral edge of the magnetic metal member is bonded to one end face of a frame; and a third step in which a portion of the film in each first through-hole is irradiated with laser light to form an opening pattern, and a portion of the film in each second through-hole is irradiated with laser light to form a mask-side alignment mark.
Claims5
A production method for a deposition mask for forming a plurality of thin-film patterns on a substrate, the production method comprising:
- a first step of forming a mask member in which a resin film and a magnetic metal member, which has a plurality of first and second through-holes formed at positions respectively corresponding to the plurality of thin-film patterns and a plurality of substrate-side alignment marks preliminarily formed on the substrate, are brought into close contact with each other, each of the first and second through-holes having a shape and dimension greater those that of the thin-film pattern, and each of the second through-holes having a shape and dimension greater than those of the substrate-side alignment mark;
- a second step in which the mask member is stretched on one end face of a frame having an opening enclosing the plurality of first and second through-holes of the magnetic metal member, and a peripheral edge of the magnetic metal member is bonded to the end face of the frame;
- and
- a third step in which a portion of the film at the position corresponding to the thin-film pattern in each of the first through-holes is irradiated with laser light to form an opening pattern having a shape and dimension the same as those of the thin-film pattern, and a portion of the film at the position corresponding to the substrate-side alignment mark in each of the second through-holes is irradiated with laser light to form a mask-side alignment mark.
Dependencies are inferred from the claim text.