Method and apparatus for precision working of material
AssigneeCarl Zeiss Meditec AG
InventorsMark Bendett, Mark Bischoff, Mario Gerlach, Dirk Mühlhoff
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Abstract
A method for precise working of material, particularly organic tissue, comprises the step of providing laser pulses with a pulse length between 50 fs and 1 ps and with a pulse frequency from 50 kHz to 1 MHz and with a wavelength between 600 and 2000 nm for acting on the material to be worked. Apparatus, in accordance with the invention, for precise working of material, particularly organic tissue comprising a pulsed laser, wherein the laser has a pulse length between 50 fs and 1 ps and with a pulse frequency of from 50 kHz to 1 MHz is also described.
Claims4
A method for precision machining of an organic tissue, the method comprising:
- providing a radiation source that generates a pulsed laser beam having a plurality of laser pulses;
- wherein the pulsed laser beam has a pulse length between 50 fs and 1 ps, a pulse frequency greater than 50 kHz, and an energy of an individual laser pulse between 100 nJ and 10 μJ;
- and
- providing a beam device that directs the pulsed laser beam to the organic tissue such that a plurality of cuts in the organic tissue are generated by photodisruption,
- wherein the plurality of the cuts divide a portion of the organic tissue into fragments capable of being extracted by a suction device.
Dependencies are inferred from the claim text.