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US 9,839,158 B2Granted
Vapor cycle convective cooling of electronics
AssigneeHamilton Sundstrand Corporation
InventorAndre Mitchell
Life of this patent
Estimating the term…
Abstract
A cold plate device and method for cooling electronic systems is provided including a generally flat thermally conductive body having a cooling channel within the thermally conductive body. A first cooling fluid travels through the cooling channel to remove heat from the conductive body. A vapor compression cycle system is coupled to the thermally conductive body such that the first cooling fluid removes heat from a second cooling fluid in a portion of the vapor compression cycle system.
Claims9
A cold plate system comprising:
- a flat thermally conductive body having an internal cooling channel integrally formed within the flat thermally conductive body through which a first cooling fluid travels to remove heat from the flat thermally conductive body;
- and
- a vapor compression cycle system including:
- a compressor located on an external surface of the flat thermally conductive body;
- an evaporator in fluid communication with the compressor located on the external surface of the flat thermally conductive body;
- a vapor channel through which a second cooling fluid, different than the first cooling fluid, travels between the compressor and the evaporator, the vapor channel formed within an interior of the flat thermally conductive body such the first cooling fluid is configured to remove heat directly from the second cooling fluid when the second cooling fluid is in vapor state, the vapor channel having a first channel end located at an external surface of the flat thermally conductive body and directly connected to the compressor at the external surface, and a second channel end located at the external surface and directly connected to the evaporator at the external surface;
- and
- an expansion valve disposed within the flat thermally conductive body.
5 more elements
A thermal management system for electronics comprising:
- a heat source;
- a cold plate mechanically and thermally coupled to the heat source, the cold plate having a generally flat thermally conductive body and an internal cooling channel integrally formed within the flat thermally conductive body through which a first cooling fluid passes, the first cooling fluid being configured to remove heat from the flat thermally conductive body;
- a vapor cycle system including:
- a compressor located on an external surface of the cold plate;
- an evaporator in fluid communication with the compressor located on the external surface of the cold plate;
- a vapor channel through which a second cooling fluid, different than the first cooling fluid, travels between the compressor and the evaporator, the vapor channel is formed within an interior of the flat thermally conductive body such that the first cooling fluid is configured to remove heat directly from the second cooling fluid when the second cooling fluid is in vapor state, the vapor channel having a first channel end located at an external surface of the flat thermally conductive body and directly connected to the compressor at the external surface, and a second channel end located at the external surface and directly connected to the evaporator at the external surface;
- and
- an expansion valve disposed within the flat thermally conductive body;
- and
- a heat dissipation device fluidly connected to the cooling channel of the cold plate to form a cycle.
7 more elements
Dependencies are inferred from the claim text.