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US 9,829,792 B2Granted
Monomer, polymer, positive resist composition, and patterning process
AssigneeShin-Etsu Chemical Co., Ltd.
InventorsKoji Hasegawa, Jun Hatakeyama, Teppei Adachi
Life of this patent
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Abstract
A polymer comprising recurring units derived from a polymerizable monomer having two structures of hydroxyphenyl methacrylate having a hydroxy group substituted with an acid labile group is used as base resin in a positive resist composition, especially chemically amplified positive resist composition. The resist composition forms a resist film which is processed by lithography into a pattern of good profile having a high resolution, minimal edge roughness, and etch resistance.
Claims12
A polymer comprising recurring units (a) having the formula (A):
- wherein R1 is hydrogen or methyl, R2 is hydrogen or a straight, branched or cyclic C1-C15 monovalent hydrocarbon group in which any constituent —CH2— may be replaced by —O—, —C(═O)—, —C(═O)—O— or —O—C(═O)—, R3 is each independently hydrogen, cyano, nitro, or a straight, branched or cyclic C1-C6 monovalent hydrocarbon group in which any constituent —CH2— may be replaced by —O—, —C(═O)—, —C(═O)—O— or —O—C(═O)—, R4 is each independently hydrogen or an acid labile group, X1 is a single bond, a C1-C12 linking group having an ester moiety, ether moiety or lactone ring, a phenylene group or naphthylene group, m is an integer of 1 to 4, and a is a positive number in the range:
- 0<a≦1.0.
Dependencies are inferred from the claim text.