Prepreg and carbon fiber reinforced composite materials
AssigneeToray Industries, Inc.
InventorsNobuyuki Arai, Norimitsu Natsume, Kenichi Yoshioka, Junko Kawasaki, Hiroshi Takezaki
Life of this patent
Estimating the term…
Abstract
A prepreg containing a carbon fiber [A] and a thermosetting resin [B], and in addition, satisfying at least one of the following (1) and (2). (1) a thermoplastic resin particle or fiber [C] and a conductive particle or fiber [D] are contained, and weight ratio expressed by [compounding amount of [C] (parts by weight)]/[compounding amount of [D] (parts by weight)] is 1 to 1000. (2) a conductive particle or fiber of which thermoplastic resin nucleus or core is coated with a conductive substance [E] is contained.
Claims12
A prepreg for a carbon fiber reinforced composite material, containing:
- carbon fiber [A];
- an epoxy resin [B] in which a thermoplastic resin is dissolved;
- thermoplastic resin particles [C];
- and
- spherical conductive particles [D] selected from the group consisting of a carbon particle, a particle having a nucleus of inorganic material that is coated with a conductive substance, and a particle having a nucleus of organic material that is coated with a conductive substance,
- wherein the carbon fiber [A] has a tensile modulus of at most 440 GPa, a tensile strength of at least 4.4 GPa and a tensile strain of at least 1.7%,
- wherein a weight ratio expressed by
- (content of [C] in parts by weight)/(content of [D] in parts by weight) is 1 to 1000,
- wherein the conductive particles [D] have an average particle diameter equal to or larger than an average particle diameter of the thermoplastic resin particles [C] and the average particle diameter is at most 150 μm,
- wherein an isomer of diaminodiphenyl sulfone is used as a hardener of the epoxy resin [B] in an equivalent ratio of the hardener to the epoxy groups contained in [B] of 0.7 to 1.0,
- wherein 90 to 100 wt % of each of the thermoplastic resin particles [C] and the conductive particles [D] is localized in a 20% depth range from both surfaces of the prepreg in the thickness direction, and
- wherein a total weight of the above-mentioned thermoplastic resin particles [C] and the above-mentioned conductive particles [D] is 1 to 20 wt % with respect to the prepreg weight.
Dependencies are inferred from the claim text.