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US 9,824,951 B2Granted
Printed circuit module having semiconductor device with a polymer substrate and methods of manufacturing the same
AssigneeQorvo US, Inc.
InventorsDirk Robert Walter Leipold, Julio C. Costa, Baker Scott
Life of this patent
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Abstract
A printed circuit module and methods for manufacturing the same are disclosed. The printed circuit module includes a printed circuit substrate with a thinned die attached to the printed circuit substrate. The thinned die includes at least one device layer over the printed circuit substrate and a buried oxide (BOX) layer over the at least one device layer. A polymer layer is disposed over the BOX layer, wherein the polymer has a thermal conductivity greater than 2 watts per meter Kelvin (W/mK) and an electrical resistivity of greater than 103 Ohm-cm.
Claims12
A printed circuit module comprising:
- a printed circuit substrate;
- a thinned die attached to the printed circuit substrate and having at least one device layer over the printed circuit substrate and a buried oxide (BOX) layer over the at least one device layer;
- a top protective layer disposed onto the printed circuit substrate and up alongside the thinned die to at least a portion of the BOX layer;
- and
- a polymer layer over the BOX layer, wherein the polymer has a thermal conductivity greater than 2 watts per meter Kelvin (W/mK) and an electrical resistivity of greater than 103 Ohm-cm.
2 more elements
Dependencies are inferred from the claim text.