Lithography alignment marks
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChing-Huang Chen, Hung-Chang Hsieh, Kuei-Liang Lu, Ya Hui Chang, Spencer Lin
Life of this patent
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Abstract
A device for semiconductor fabrication includes a substrate and a layer formed over the substrate, wherein the layer includes an alignment mark. The alignment mark includes a first plurality of elongated members that are oriented lengthwise along a first direction and are distributed along a second direction. The alignment mark further includes a second plurality of elongated members that are oriented lengthwise along a third direction perpendicular to the first direction and are distributed along the second direction, wherein the second direction is different from each of the first and third directions.
Claims20
A device for semiconductor fabrication, comprising:
- a substrate;
- and
- a layer formed over the substrate, the layer having an alignment mark, wherein the alignment mark includes:
- a first plurality of elongated members that are oriented lengthwise along a first direction, wherein middle points of the first plurality of elongated members are distributed along a second direction;
- and
- a second plurality of elongated members that are oriented lengthwise along a third direction perpendicular to the first direction, wherein middle points of the second plurality of elongated members are distributed along the second direction, wherein the second direction is different from each of the first and third directions.
A device for semiconductor fabrication, comprising:
- a substrate;
- and
- a layer formed over the substrate, the layer having an alignment mark, wherein the alignment mark includes:
- a first plurality of elongated members that are oriented lengthwise along a first direction, wherein middle points of the first plurality of elongated members are distributed along a second direction;
- a second plurality of elongated members that are oriented lengthwise along a third direction perpendicular to the first direction, wherein middle points of the second plurality of elongated members are distributed along the second direction, wherein the second direction is different from each of the first and third directions;
- a third plurality of elongated members that are oriented lengthwise along the first direction, wherein middle points of the third plurality of elongated members are distributed along a fourth direction that is different from each of the first, second, and third directions;
- and
- a fourth plurality of elongated members that are oriented lengthwise along the third direction, wherein middle points of the fourth plurality of elongated members are distributed along the fourth direction.
A device for semiconductor fabrication, comprising:
- a semiconductor substrate;
- and
- a layer formed over the semiconductor substrate, the layer having an alignment mark, wherein the alignment mark includes:
- a first plurality of elongated members that are oriented lengthwise along a first direction, wherein middle points of the first plurality of elongated members are distributed along a second direction;
- and
- a second plurality of elongated members that are oriented lengthwise along a third direction perpendicular to the first direction, wherein middle points of the second plurality of elongated members are distributed along a fourth direction, wherein each of the second and fourth directions is different from each of the first and third directions and the second direction is substantially parallel to the fourth direction.
Dependencies are inferred from the claim text.