Flexible electronics for wearable healthcare sensors
AssigneeInternational Business Machines Corporation
InventorsPaul S. Andry, Huan Hu, Katsuyuki Sakuma
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Abstract
Aspects include a method of manufacturing a flexible electronic structure that includes a metal or doped silicon substrate. Aspects include depositing an adhesive layer on the top side of the structure. Aspects also include depositing a release layer and a glass layer on the top side of the structure. Aspects also include reducing a thickness of the silicon substrate on the bottom side of the structure.
Claims20
A method of manufacturing a flexible electronic structure, the electronic structure having a top side and a bottom side, the method comprising:
- patterning a metal conductive material on a silicon substrate on the top side of the structure;
- depositing an adhesive layer on the top side of the structure;
- depositing a release layer and a glass layer on the top side of the structure;
- reducing a thickness of the silicon substrate on the bottom side of the structure to a thickness of 1 μm to 50 μm;
- applying a polymer microchannel layer comprising a plurality of vias to the top side of the structure;
- and
- filling the vias with a conductive metal material that is liquid at room temperature such that the conductive metal material that is liquid at room temperature contacts the metal conductive material.
A method for manufacturing a flexible electronic structure having a top side and a bottom side, the method comprising:
- patterning a metal on a silicon substrate on the top side of the structure;
- etching the silicon substrate on the top side of the structure with deep reactive ion etch;
- depositing an adhesive layer on the top side of the structure;
- depositing a release layer and a glass layer on the top side of the structure;
- reducing a thickness of the silicon substrate on the bottom side of the structure to a thickness of 1 μm to 50 μm;
- applying a polymer microchannel layer comprising a plurality of vias to the top side of the structure;
- and
- filling the vias with a conductive metal material that is liquid at room temperature such that the conductive metal material that is liquid at room temperature contacts the metal.
A method of manufacturing a flexible electronic structure, the electronic structure having a top side and a bottom side, the method comprising:
- doping a silicon substrate on the top side of the structure with a dopant to form a doped region;
- depositing a metal ohmic contact material on the doped region;
- depositing an adhesive layer on the top side of the structure;
- depositing a release layer and a glass layer on the top side of the structure;
- reducing a thickness of the silicon substrate on the bottom side of the structure to a thickness of 1 μm to 50 μm;
- applying a polymer microchannel layer comprising a plurality of vias to the top side of the structure;
- and
- filling the vias with a conductive metal material that is liquid at room temperature such that the conductive metal material that is liquid at room temperature contacts the metal ohmic contact material.
Dependencies are inferred from the claim text.