Mold release treatment method and method for producing anti-reflective film
AssigneeSharp Kabushiki Kaisha
InventorHidekazu Hayashi
Life of this patent
Estimating the term…
Abstract
A mold release processing method according to an embodiment of the present invention includes the steps of: (a) providing a mold releasing agent, including a fluorine-based silane coupling agent and a solvent, and a mold of which the surface has a porous alumina layer; (b) applying the mold releasing agent onto the surface; and (c) heating, either before or after the step (b), the surface to a temperature not less than 40° C. and less than 100° C. in an ambient with a relative humidity of 50% or more.
Claims6
A mold release processing method comprising the steps of:
- (a) providing a mold releasing agent, including a fluorine-based silane coupling agent and a solvent, and a mold of which the surface has a porous alumina layer;
- (b) applying the mold releasing agent onto a surface of the porous alumina layer to which no mold releasing agent has been applied yet;
- (c1) heating, after a final anodizing step of the mold and before the step (b), the surface of the porous alumina layer to a temperature not less than 40° C. and less than 100° C. in an ambient with a relative humidity of 50% to 90%;
- and
- (c2) heating, after the step (b), the surface of the mold to a temperature not less than 50° C. and less than 100° C. in an ambient with a relative humidity of 50% to 90%.
A method of making an antireflection film, the method comprising the steps of:
- providing a mold which has been subjected to a mold release process, wherein the mold release process comprises the steps of:
- (a) providing a mold releasing agent, including a fluorine-based silane coupling agent and a solvent, and a mold of which the surface has a porous alumina layer;
- (b) applying the mold releasing agent onto a surface of the porous alumina layer to which no mold releasing agent has been applied yet;
- (c1) heating, after a final anodizing step of the mold and before the step (b), the surface of the porous alumina layer to a temperature not less than 40*C and less than 100° C. in an ambient with a relative humidity of 50% to 90%;
- and
- (c2) heating, after the step (b), the surface of the mold to a temperature not less than 50° C. and less than 100° C. in an ambient with a relative humidity of 50% to 90%;
- providing a workpiece;
- irradiating a photocurable resin which is interposed between the mold and the workpiece with light, thereby curing the photocurable resin;
- and
- peeling an antireflection film of the photocurable resin that has been cured off the mold.
Dependencies are inferred from the claim text.