Package and method for fabricating package
AssigneeNEC Space Technologies, Ltd.
InventorsRieka Ouchi, Yasuhiro Ishii, Hideki Tanaka
Life of this patent
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Abstract
A package that hermetically seals an integrated circuit includes a metal lid (7) and a metal housing (10) having an open upper portion (12). In the package, the housing (10) includes in a wall surface thereof a glass unit (2) that seals a plurality of lead terminals therein. The glass unit (2) is disposed in a wall surface of the housing (10) such that a thickness in a vertical direction of the wall surface on an upper side of the glass unit (2) is determined according to a threshold limit value of a difference in temperature between glass that forms the glass unit (2) and metal that forms the wall surface.
Claims8
A package that hermetically seals an integrated circuit, the package comprising:
- a metal housing having an open upper portion;
- and
- a metal lid,
- wherein the metal housing includes a metal unit and a glass unit configured to hold a plurality of lead terminals in a central section of a front wall of the metal housing,
- wherein the glass unit includes lead terminals which are vertically arranged on an upper side of a horizontally extended centerline of the glass unit, and
- wherein a thickness in a vertical direction of the metal unit on an upper side of the glass unit is set such that heat capacity of the metal unit is set to a level where stress caused by a difference between a temperature of the glass unit and a temperature of the metal unit would not damage the glass unit when a process for sealing the metal housing and the metal lid is performed.
A method for fabricating a package that hermetically seals an integrated circuit with use of a metal housing having an open upper portion and of a metal lid, the method comprising:
- forming a metal housing having an open upper portion and a terminal sealing hole in a central section of a front wall of the metal housing,
- forming a preformed glass for holding a plurality of lead terminals,
- fitting the preformed glass into the terminal sealing hole, and
- firing the metal housing together with the preformed glass to form the housing having a glass unit,
- wherein, when forming the preformed glass, vertically arranging lead terminals on an upper side of the horizontally extended centerline of the preformed glass, and
- forming the glass unit such that a thickness in a vertical direction of a metal unit on an upper side of the glass unit is set such that heat capacity of the metal unit is set to a level where stress caused by a difference between a temperature of the glass unit and a temperature of the metal unit would not damage the glass unit when a process for sealing the metal housing and the metal lid is performed.
Dependencies are inferred from the claim text.