Housing for electronic device and manufacturing method thereof
AssigneeSamsung Electronics Co., Ltd.
InventorsKwang-Jin Bae, Hee-Cheul Moon, Ik-Su Jung, Jong-Chul Choi
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Abstract
A housing forms the appearance of an electronic device. A method of manufacturing the housing includes selecting at least one fiber substrate for securing rigidity and at least one fiber substrate for securing ductility, determining quantity and stacking sequence of the selected fiber substrates, and laminating and attaching the fiber substrates according to the determined quantity and stacking sequence.
Claims22
A method of manufacturing an electronic device including a housing and plurality of electronic components, the method comprising:
- selecting at least one fiber substrate for securing rigidity and at least one fiber substrate for securing ductility;
- determining a quantity and stacking sequence of the selected fiber substrates;
- and
- laminating and attaching the fiber substrates according to the determined quantity and stacking sequence, and
- insert molding a plastic injection molding product that is attached to an inner side of the composite materials,
- wherein the plastic injection molding product includes a top surface that is attached along a bottom surface of the composite materials, and
- wherein a center of the top surface of the plastic injection molding product includes an omitted portion where injection products are omitted from the plastic injection molding product with at least one slit that is formed in a direction from an edge of the omitted portion.
A method of manufacturing an electronic device including a housing and plurality of electronic components, the method comprising:
- selecting a plurality of prepregs;
- determining a quantity and stacking sequence of the selected prepregs;
- determining cross angles of fiber arrays between the selected prepregs;
- and
- laminating and attaching the prepregs according to the determined quantity, stacking sequence, and cross angles, and
- insert molding a plastic injection molding product that is attached to an inner side of the composite materials,
- wherein the plastic injection molding product includes a top surface that is attached along a bottom surface of the composite materials, and
- wherein a center of the top surface of the plastic injection molding product includes an omitted portion where injection products are omitted from the plastic injection molding product with at least one slit that is formed in a direction from an edge of the omitted portion.
An electronic device comprising:
- a plurality of electronic components;
- and
- at least one housing configured to protect the electronic components and form an appearance of the electronic device,
- wherein the at least one housing includes composite materials in which at least two fiber substrates are laminated and attached, and
- a plastic injection molding product that is attached to an inner side of the composite materials by insert molding,
- wherein the plastic injection molding product includes a top surface that is attached along a bottom surface of the composite materials, and
- wherein a center of the top surface of the plastic injection molding product includes an omitted portion where injection products are omitted from the plastic injection molding product with at least one slit that is formed in a direction from an edge of the omitted portion.
Dependencies are inferred from the claim text.