Flexible electronic assembly method

A method, comprising:

• securing microelectronic components with respect to one another with an adhesive foil and a carrier;
• molding a polymer mold over the plurality of microelectronic components by surrounding the microelectronic components and contacting the adhesive foil with the polymer mold, the polymer mold assuming a substantially rigid state following the molding;
• forming a routing layer with respect to the microelectronic component and the polymer mold, the routing layer including traces electrically coupled to the microelectronic component;
• applying an input to the polymer mold, the polymer mold transitioning from the substantially rigid state to a substantially flexible state upon application of the input.