Printed circuit board and method of manufacturing the same

A printed circuit board comprising:

• an insulating layer;
• a plating seed layer disposed on the insulating layer and formed of copper (Cu);
• a circuit pattern disposed on the plating seed layer;
• and
• a top metal layer disposed on the circuit pattern,
• wherein the circuit pattern comprises:
• a first circuit pattern disposed on the plating seed layer and formed of copper (Cu), and
• a second circuit pattern disposed on the first circuit pattern and formed of copper (Cu),
• wherein a thickness of the second circuit pattern is thinner than a thickness of the first circuit pattern,
• wherein the top metal layer is formed of gold (Au),
• wherein a width of a lower surface of the top metal layer is wider than a width of an upper surface of the second circuit pattern,
• wherein a first part of a lower surface of the second circuit pattern is positioned at a lower level than a first part of an upper surface of the first circuit pattern,
• wherein the first part of the lower surface of the second circuit pattern is in direct physical contact with the first circuit pattern, and
• wherein the lower surface of the top metal layer comprises:
• a first portion in contact with the upper surface of the second circuit pattern;
• and a second portion spaced apart from the plating seed layer, the first circuit pattern, and the second circuit pattern by respective predetermined distances.