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AssigneeHangzhou Hpwinner Opto Corporation
InventorsKai Chen, Jianming Huang, Huali Lu
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A lamp-housing-type heat-sink in an LED lighting device is provided, which is a hollow middle part formed monolithically by extending a high purity aluminum plate with a thickness of 0.5 mm to 5 mm and an aluminum content of above 95%. The heat-sink has a heat-sinking surface and housing body. A surface contact structure is formed between the heat-sinking surface and a circuit board, and several radiating holes are set on the housing body to form heat dissipation channels. A method for manufacturing the lamp-housing-type heat-sink in LED lighting device is also provided. The lamp-housing-type heat-sink uses fewer materials and costs less than conventional die-cast aluminum housing, while providing a higher thermal conductivity co-efficient.
A method for manufacturing a lamp-housing-type heat-sink in an LED lighting device, comprising the following steps:
A lamp-housing-type heat-sink in a lighting device for heat radiation, wherein the lamp-housing-type heat-sink is made monolithically by extending a high purity aluminum plate with a thickness of 0.5 mm to 5 mm and an aluminum content of above 95%, the lamp-housing-type heat-sink is hollow and composed of a heat-sinking surface and a housing body, a surface contact structure is formed between the heat-sinking surface and a circuit board, a plurality of radiating holes are set on the housing body to form heat dissipation channels, and the housing body has an open end and a sidewall that extends from and is tapered towards the open end of the lamp-housing-type heat-sink.
A method for manufacturing a lamp-housing-type heat-sink in an LED lighting device, comprising the following steps:
Dependencies are inferred from the claim text.