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US 9,810,220 B2Granted
Method of transporting rotating equipment modularization
AssigneeFluor Technologies Corporation
InventorNeetin Ghaisas
Life of this patent
Estimating the term…
Abstract
A module for an engineering, procurement, and construction (EPC) project is described. The module comprises machinery disposed on a baseplate. The baseplate is coupled with a support structure via adjustable, self-leveling chocks. The chocks maintain a level baseplate surface regardless of whether or not the underside of the baseplate and the support structure are parallel. The chocks reduce and/or eliminate the transfer of the deflection forces from the support structure to the baseplate.
Claims10
A method of transporting machinery in a modular fashion, comprising the steps of:
- assembling a module that comprises the machinery, a baseplate, at least two support structures, and a plurality of self-leveling chocks by:
- securing the baseplate to a first support structure by placing a first self leveling chock and a second self-leveling chock between the baseplate and the first support structure;
- securing the baseplate to a second support structure by placing a third self-leveling chock and a fourth self-leveling chock between the baseplate and the second support structure;
- placing the machinery on top of the baseplate and optionally securing the machinery to the baseplate;
- transporting the module from a first location to a second location such that at least one of the first and second support structures experiences at least one of deflection, bend, or twist;
- and
- wherein the self-leveling chocks reduce or isolate the transfer of at least one of deflection forces, bending forces, and twisting forces from the at least one of the first and second support structure to the baseplate.
4 more elements
Dependencies are inferred from the claim text.