Methods for top-down fabrication of wafer scale TMDC monolayers

A method of forming a transition metal dichalcogenide (TMDC) monolayer, comprising:

• obtaining a multi-layer TMDC film from a bulk single crystal TMDC source via mechanical exfoliation, the multi-layer TMDC film comprising a plurality of layers of the TMDC;
• positioning the multi-layer TMDC film on a conducting substrate;
• contacting the conducting substrate and the multi-layer TMDC film with an electrolyte solution;
• applying a predetermined electrode potential on the conducting substrate for a predetermined time;
• and
• removing, by application of the predetermined electrode potential, a portion of the plurality of layers of the TMDC included in the multi-layer TMDC film, thereby leaving a TMDC monolayer film positioned on the conducting substrate.

A method, comprising:

• positioning an adhesive strip on a bulk single crystal TMDC source;
• removing the adhesive strip from the bulk single crystal TMDC source such that a TMDC film remains adhered to the adhesive strip, the TMDC film comprising a plurality of multi-layer TMDC flakes, each multi-layer TMDC flake of the plurality of TMDC flakes comprising a plurality of TMDC layers;
• positioning the adhesive strip on a conducting substrate such that the TMDC film contacts the conductive substrate;
• heating the conducting substrate to a predetermined temperature for a predetermined heating time;
• immersing the conducting substrate and the adhesive strip in a solvent;
• sonicating the solvent so as to dissolve the adhesive strip, thereby leaving the TMDC film disposed on the conducting substrate;
• contacting the conducting substrate and the multi-layer TMDC film with an electrolyte solution;
• applying a predetermined electrode potential on the conducting substrate for a predetermined time;
• and
• removing, by application of the predetermined electrode potential, a portion of the plurality of layers of the TMDC included in the multi-layer TMDC film, thereby leaving a TMDC monolayer film positioned on the conducting substrate.