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US 9,809,883 B2Granted
Formaldehyde free electroless copper plating compositions and methods
AssigneeRohm and Haas Electronic Materials LLC
InventorsAndy Lok-Fung Chow, Dennis Kwok-Wai Yee, Crystal P. L. Li
Life of this patent
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Abstract
The copper electroless baths are formaldehyde free and are environmentally friendly. The electroless copper baths include one or more sulfinate compounds as reducing agents to replace formaldehyde. The electroless baths are stable and deposit a bright copper on substrates.
Claims1
A method comprising:
- a) providing a printed wiring board comprising a plurality of through-holes;
- b) desmearing the through-holes;
- and
- c) depositing copper on walls of the through-holes using an electroless copper composition consisting of one or more sources of copper ions, one or more chelating agents selected from the group consisting of polycarboxylic acids, salts thereof, polyaminocarboxylic acids and salts thereof, water, optionally one or more stabilizers selected from the group consisting of amines, alkanolamines, thioamides, azoles and salts thereof, optionally one or more surfactants, and one or more reducing agents having formula:
- wherein Xy+ is a neutralizing counter cation of formula (I), where y+ is an integer of one or greater and Xy+ may be H+, ammonium cation, quaternary ammonium cation, sulfonium cation, phosphonium cation, pyradinium cation, monovalent metal cation, multivalent metal cation or divalent organometallic cation;
- R and R′ are independently hydrogen, carboxyl, carboxyalkyl, sulfonate, sulfoxide, unsubstituted, linear or branched alkyl, sulfinate;
- substituted or unsubstituted aryl;
- Z is chosen from unsubstituted, linear or branched (C1-C6)alkyl, acetyl or substituted or unsubstituted (C6-C10) aryl;
- m is an integer of 1 to 6;
- and n is 1;
- and the composition is free of formaldehyde.
8 more elements
Dependencies are inferred from the claim text.