Endblock for rotatable target with electrical connection between collector and rotor at pressure less than atmospheric pressure

A sputtering apparatus comprising:

• at least one endblock for supporting an end of a cylindrical rotatable sputtering target, the endblock including a fixed conductive collector and a rotatable conductive rotor for rotating with the cylindrical sputtering target during sputtering operations;
• the endblock further including an electrical power transfer structure located between the fixed conductive collector and the rotatable rotor for allowing electrical power to be transferred from the collector to the rotor;
• a first cooling area through which liquid flows for cooling the fixed conductive collector, the first cooling area being located around at least a portion of the fixed conductive collector and being substantially concentric with the fixed conductive collector;
• a second cooling area, separate from the first cooling area, through which liquid flows for cooling the rotor and target, the second cooling area being at least partially surrounded by the rotor, and wherein the liquid in the second cooling area flows in at least a direction that is substantially parallel to an axis about which the target and rotor are to rotate;
• wherein the electrical power transfer structure comprises a conductive brush that when viewed in cross section from a point of view perpendicular to the axis is located between at least the first and second cooling areas along a line drawn perpendicular to the axis, and wherein the brush is located closer to the axis than is the first cooling area;
• wherein the liquid in the first cooling area flows around the axis about which the target and rotor are to rotate;
• and
• wherein the electrical power transfer structure, the rotor, and the collector are each located in an area under vacuum having pressure less than atmospheric pressure during sputtering operations.