Highly-thermally-conductive resin composition, and resin material for heat dissipation/heat transfer and thermally conductive film comprising same

A resin composition comprising:

• a resin having a main chain structure including:
• a unit (A) by 40 mol % to 60 mol %, the unit (A) having a biphenyl group and being represented by general formula (1):
• a unit (B) by 5 mol % to 40 mol %, the unit (B) being represented by general formula (2):
• —CO—R1—CO— (2)
• wherein R1 represents a bivalent linear substituent (a) whose number of atoms in its main chain length is 2 to 18 and (b) which is branched or not branched;
• and
• a unit (C) by 5 mol % to 40 mol %, the unit (C) being represented by general formula (3):
• —CO—R2—CO— (3)
• wherein R2 represents a bivalent linear substituent (a) whose number of atoms in its main chain length is 4 to 20 and is larger than the number of atoms in the main chain length of R1 and (b) which is branched or not branched,
• where a total amount of the units (A), (B), and (C) is 100 mol %, and a thermal conductivity of the resin itself is not less than 0.4 W/(m·K);
• and
• an inorganic filler having thermal conductivity of not less than 1 W/(m·K).