Circuit materials and articles formed therefrom
AssigneeRogers Corporation
InventorThomas A. Koes
Life of this patent
Estimating the term…
Abstract
Disclosed is a circuit material, including dielectric substrate or a circuit subassembly further comprising a conductive layer, that is formed from a precursor composition, wherein the precursor composition comprises, based on the total weight of the precursor composition, thermosetting resin or thermoplastic polymer, optionally monomeric triallyl isocyanurate or triallyl cyanurate, dispersed particles of poly(triallyl isocyanurate) or poly(triallyl cyanurate), and optionally inorganic filler, wherein the circuit material has a Df of less than 0.0060 at 10 GHz. Also disclosed is a method of manufacturing such a circuit material in which emulsion polymerized particles of poly(triallyl isocyanurate) or poly(triallyl cyanurate) are dispersed in a thermosetting or thermoplastic resin.
Claims25
A circuit material, comprising a dielectric layer comprising a polymer component, wherein the polymer component comprises:
- a continuous polymeric matrix;
- and
- particles comprising a poly(triallyl isocyanurate), a poly(triallyl cyanurate), a copolymer comprising at least one of the foregoing, or a combination comprising at least one of the foregoing, wherein the particles are dispersed in the continuous polymeric matrix;
- and
- wherein the circuit material has
- a dissipation factor (Df) of less than 0.0060 at 10 GHz, and
- a dielectric constant (Dk) of less than 3.8 at 10 GHz.
A circuit subassembly, comprising
- a conductive metal layer;
- and
- a circuit material comprising a dielectric layer comprising a polymer component, wherein the polymer component comprises:
- a continuous polymeric matrix;
- and
- particles comprising a poly(triallyl isocyanurate), a poly(triallyl cyanurate), a copolymer comprising at least one of the foregoing, or a combination comprising at least one of the foregoing, wherein the particles are dispersed in the continuous polymeric matrix;
- and
- wherein the circuit material has
- a dissipation factor (Df) of less than 0.0060 at 10 GHz, and
- a dielectric constant (Dk) of less than 3.8 at 10 GHz;
- wherein a peel strength between the conductive metal layer and the dielectric layer is greater than 4.0 pounds per inch.
A method of making a dielectric layer comprising a polymer component for a circuit material, the method comprising
- combining a thermoplastic polymer, a thermosetting resin, or a combination comprising at least one of the foregoing with a plurality of polymer particles comprising poly(triallyl isocyanurate), poly(triallyl cyanurate), a copolymer comprising at least one of the foregoing, or a combination comprising at least one of the foregoing, and having decomposition temperature greater than 400° C., to provide a precursor composition;
- and
- forming the precursor composition into a dielectric layer, wherein the thermoplastic polymer, thermosetting resin or a combination comprising at least one of the foregoing is a continuous polymeric matrix, and wherein the polymer particles are dispersed in the continuous polymeric matrix.
Dependencies are inferred from the claim text.