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US 9,809,446 B1Granted
Semiconductor package and manufacturing method thereof
AssigneeAmkor Technology, Inc.
InventorsJae Ung Lee, Byong Jin Kim, Young Seok Kim, Wook Choi, Seung Jae Yoo, Yung Woo Lee, EunNaRa Cho, Dong Hyun Bang
Life of this patent
Estimating the term…
Abstract
A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and a method of manufacturing thereof, that comprises a first semiconductor die, a plurality of adhesive regions spaced apart from each other on the first semiconductor die, and a second semiconductor die adhered to the plurality of adhesive regions.
Claims22
A semiconductor device comprising:
- a substrate;
- a first semiconductor die having a top first die surface and a bottom first die surface, wherein the bottom first die surface is coupled to the substrate, and the first semiconductor die is electrically connected to the substrate;
- a plurality of adhesive regions spaced apart from each other on the top first die surface;
- and
- a second semiconductor die having a top second die surface and a bottom second die surface, wherein the bottom second die surface is adhered to the plurality of adhesive regions, and the second semiconductor die is electrically connected to the substrate,
- wherein each of the adhesive regions comprises only adhesive material and bridges an entire vertical gap between the top first die surface and the bottom second die surface.
3 more elements
A semiconductor device comprising:
- a substrate;
- a first semiconductor die having a top first die surface and a bottom first die surface, wherein the bottom first die surface is coupled to the substrate, and the first semiconductor die is electrically connected to the substrate;
- a plurality of adhesive regions spaced apart from each other on the top first die surface;
- and
- a second semiconductor die having a top second die surface and a bottom second die surface, wherein the bottom second die surface is adhered to the plurality of adhesive regions, and the second semiconductor die is electrically connected to the substrate,
- wherein each of the plurality of adhesive regions comprises:
- a first adhesive layer on and adhered to the top first die surface;
- a central layer comprising a central film on top of and adhered to the first adhesive layer;
- and
- a second adhesive layer on top of and adhered to the central layer, and adhered to the bottom second die surface.
7 more elements
A semiconductor device comprising:
- a first semiconductor die having a top first die surface;
- adhesive material on the top first die surface and comprising a plurality of volumes of the adhesive material separated from each other by a space;
- and
- a second semiconductor die having a bottom second die surface, wherein the bottom second die surface is adhered to the plurality of volumes of the adhesive material,
- wherein the adhesive material comprises the only material that is directly between the first and second semiconductor dies.
2 more elements
A semiconductor device comprising:
- a substrate;
- a first semiconductor die having a top first die surface and a bottom first die surface, wherein the bottom first die surface is coupled to the substrate, and the first semiconductor die is electrically connected to the substrate;
- a plurality of adhesive regions spaced apart from each other on the top first die surface;
- and
- a second semiconductor die having a top second die surface and a bottom second die surface, wherein the bottom second die surface is adhered to the plurality of adhesive regions, and the second semiconductor die is electrically connected to the substrate
- wherein each of the plurality of adhesive regions comprises:
- a first adhesive region on and adhered to the top first die surface, the first adhesive region comprising a first adhesive;
- and
- a second adhesive region on and adhered to the top first die surface and the first adhesive region, and adhered to the bottom second die surface, the second adhesive region comprising a second adhesive different from the first adhesive.
6 more elements
Dependencies are inferred from the claim text.