Light-emitting device, method for manufacturing same, and molded part

A method for manufacturing a molded part for a light-emitting device, wherein the method comprises:

• melt mixing a 1,3,5-triazine nucleus derived epoxy resin with an acid anhydride, thereby forming (A) a reaction product in an epoxy group equivalent to acid anhydride group equivalent ratio from 0.6 to 2.0;
• mixing the (A) reaction product with (B) an internal parting agent comprising glycerol monostearate having a melting point of 50 to 70° C., (C) a reflective agent including titanium dioxide, (D) an inorganic filler, and (E) a curing catalyst to form a thermosetting epoxy resin composition, wherein the internal parting agent (B) is present in an amount of 0.2 to 5.0% by weight based on the total weight of the composition;
• and
• transfer molding the thermosetting epoxy resin composition in a mold with leads disposed therein, thereby making the molded part comprising the leads and the thermosetting epoxy resin composition in a cured state,
• wherein the molded part forms a side surface or a bottom surface of a recess, and has a high reflectance so as to reduce transmission of light from a light-emitting element into the surface, wherein the reflectance is at least 70% at a wavelength of 430 nm or longer, and wherein an (F) antioxidant is mixed with the triazine derived epoxy resin and acid anhydride in the melt mixing step so as to become a part of the (A) reaction product.