Method of monitoring a dressing process and polishing apparatus
AssigneeEbara Corporation
InventorHiroyuki Shinozaki
Life of this patent
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Abstract
A method of monitoring dressing of a polishing pad is provided. The method includes: rotating a polishing table that supports the polishing pad; dressing the polishing pad by pressing a dresser against the polishing pad while causing the dresser to oscillate in a radial direction of the polishing pad; calculating a work coefficient representing a ratio of a frictional force between the dresser and the polishing pad to a force of pressing the dresser against the polishing pad; and monitoring dressing of the polishing pad based on the work coefficient.
Claims18
A method of monitoring dressing of a polishing pad, said method comprising:
- rotating a polishing table that supports the polishing pad;
- dressing the polishing pad by pressing a dresser against the polishing pad while causing the dresser to oscillate in a radial direction of the polishing pad;
- calculating a work coefficient representing a ratio of a frictional force between the dresser and the polishing pad to a force of pressing the dresser against the polishing pad;
- monitoring dressing of the polishing pad based on the work coefficient;
- and
- determining a remaining life of the dresser based on the work coefficient.
A polishing apparatus for polishing a substrate, comprising:
- a polishing table configured to support a polishing pad;
- a table motor configured to rotate the polishing table;
- a dresser configured to dress the polishing pad;
- a swing motor configured to cause the dresser to oscillate in a radial direction of the polishing pad;
- a pressing device configured to press the dresser against the polishing pad;
- and
- a pad monitoring device configured to monitor dressing of the polishing pad,
- the pad monitoring device being configured to
- calculate a work coefficient representing a ratio of a frictional force between the dresser and the polishing pad to a force of pressing the dresser against the polishing pad,
- monitor dressing of the polishing pad based on the work coefficient, and
- determine a remaining life of the dresser based on the work coefficient.
Dependencies are inferred from the claim text.