Method of polishing back surface of substrate and substrate processing apparatus
AssigneeEbara Corporation
InventorsYu Ishii, Kenya Ito, Masayuki Nakanishi, Tetsuji Togawa
Life of this patent
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Abstract
A polishing method which can remove foreign matters from an entire back surface of a substrate at a high removal rate is provided. The polishing method includes placing a polishing tool in sliding contact with an outer circumferential region of a back surface of a substrate while holding a center-side region of the back surface of the substrate, and placing a polishing tool in sliding contact with the center-side region of the back surface of the substrate while holding a bevel portion of the substrate to polish the back surface in its entirety.
Claims16
A polishing method of polishing an entirety of a back surface of a substrate, comprising:
- first polishing an outer circumferential region of the back surface of the substrate by placing a first polishing tool in sliding contact with the outer circumferential region of the back surface of the substrate, while holding a center-side region of the back surface of the substrate;
- second polishing the center-side region of the back surface of the substrate by placing a second polishing tool in sliding contact with the center-side region of the back surface of the substrate, while holding the substrate, supporting a front side of the substrate, and rotating the second polishing tool around an axis of a rotational shaft which extends in a direction perpendicular to the back surface of the substrate;
- and
- inverting the substrate, said inverting being performed between said first polishing and said second polishing,
- wherein the first polishing tool is placed in sliding contact with only the back surface of the substrate during the first polishing.
A polishing method of polishing an entirety of a back surface of a substrate, comprising:
- first polishing an outer circumferential region of the back surface of the substrate by placing a first polishing tool in sliding contact with the outer circumferential region of the back surface of the substrate, while holding a center-side region of the back surface of the substrate;
- second polishing the center-side region of the back surface of the substrate by placing a second polishing tool in sliding contact with the center-side region of the back surface of the substrate, while holding the substrate, supporting a front side of the substrate, and rotating the second polishing tool around an axis of a rotational shaft which extends in a direction perpendicular to the back surface of the substrate;
- and
- inverting the substrate, said inverting being performed between said first polishing and said second polishing,
- wherein the second polishing tool oscillates in a radial direction of the substrate during the second polishing.
A polishing method of polishing an entirety of a back surface of a substrate, comprising:
- first polishing an outer circumferential region of the back surface of the substrate by placing a first polishing tool in sliding contact with the outer circumferential region of the back surface of the substrate, while holding a center-side region of the back surface of the substrate;
- second polishing the center-side region of the back surface of the substrate by placing a second polishing tool in sliding contact with the center-side region of the back surface of the substrate, while holding the substrate and supporting a front side of the substrate;
- and
- inverting the substrate, said inverting being performed between said first polishing and said second polishing.
Dependencies are inferred from the claim text.