Tool and method of reflow
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsShih-Yen Chen, Tzi-Yi Shieh, Yuh-Sen Chang, Chung-Li Lee
Life of this patent
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Abstract
A tool and a method of reflow are provided. In various embodiments, the tool includes a chamber unit, a wafer lifting system, a heater, and an exhausting unit. The wafer lifting system is disposed in the chamber unit. The heater is coupled to the chamber unit, and configured to heat the wafer. The exhausting unit coupled to the chamber unit, and configured to exhaust gas in the chamber unit. The wafer lifting system is configured to receive and move the wafer in the chamber unit, and to provide a vertical distance between the heater and the wafer in the chamber unit.
Claims15
A tool comprising:
- a ring shape chamber unit having an inner cylindrical wall and an outer cylindrical wall, wherein the inner cylindrical wall and the outer cylindrical wall defines the ring shape chamber;
- a wafer lifting system disposed in the ring shape chamber, wherein the wafer lifting system comprises a wafer holder configured to support a wafer and a lifting pin coupled to the wafer holder;
- a heater coupled to the ring shape chamber unit, and configured to heat the wafer;
- and
- an exhausting unit coupled to the ring shape chamber unit, and configured to exhaust gas in the ring shape chamber,
- wherein the heater is disposed between the exhausting unit and the wafer lifting system, and the wafer lifting system is configured to move the wafer in a spiral motion and to provide varying vertical distance between the heater and the wafer by vertically moving the lifting pin as the wafer lifting system moves in a spiral motion within the ring shape chamber.
A tool comprising:
- a ring shape chamber unit having an inner cylindrical wall and an outer cylindrical wall, wherein the inner cylindrical wall and the outer cylindrical wall defines a ring shape chamber;
- a wafer lifting system disposed in the ring shape chamber, wherein the wafer lifting system comprises a wafer holder configured to support a wafer and a lifting pin coupled to the wafer holder;
- a heater coupled to the ring shape chamber unit, and configured to heat the wafer;
- a jet system coupled to the ring shape chamber unit, and configured to jet a deoxidizing gas on the wafer;
- and
- an exhausting unit coupled to the ring shape chamber unit, and configured to exhaust gas in the ring shape chamber,
- wherein the heater is disposed between the exhausting unit and the wafer lifting system, and the wafer lifting system is configured to move the wafer in a spiral motion and to provide varying vertical distance between the heater and the wafer by vertically moving the lifting pin as the wafer lifting system moves in a spiral motion within the ring shape chamber.
A tool comprising:
- a ring shape chamber unit having an inner cylindrical wall and an outer cylindrical wall, wherein the inner cylindrical wall and the outer cylindrical wall defines a ring shape chamber;
- at least one front opening unified pod coupled to the ring shape chamber unit;
- a wafer lifting system disposed in the ring shape chamber, wherein the wafer lifting system comprises a wafer holder configured to support a wafer and a lifting pin coupled to the wafer holder;
- a heater coupled to the ring shape chamber unit, and configured to heat the wafer;
- and
- an exhausting unit configured to exhaust gas in the ring shape chamber, wherein the heater is disposed between the exhausting unit and the wafer lifting system,
- wherein the wafer lifting system is configured to move the wafer in a spiral motion and to provide varying vertical distance between the heater and the wafer by vertically moving the lifting pin as the wafer lifting system moves in a spiral motion within the ring shape chamber.
Dependencies are inferred from the claim text.