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US 9,808,890 B2Granted
Solder alloy
AssigneeSenju Metal Industry Co., Ltd.
InventorsHikaru Nomura, Shunsaku Yoshikawa
Life of this patent
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Abstract
A solder alloy has an alloy composition containing Zn of 3 through 25 mass %, Ti of 0.002 through 0.25 mass %, Al of 0.002 through 0.25 mass % and balance of Sn, a solder joint made of the solder alloy, and a jointing method using the solder alloy.
Claims8
A solder joint made of a solder alloy having an alloy composition comprising Zn of 3 through 25 mass %, Ti of 0.002 through 0.25 mass %, Al of 0.002 through 0.25 mass %, Ni of 0.005 through 0.3 mass % and balance of Sn,
- wherein the solder joint forms a metal junction between the alloy and an Al surface or an Ni surface.
Dependencies are inferred from the claim text.